A Facile Preparation Method for Corrosion-Resistant Copper Superhydrophobic Surfaces with Ordered Microstructures by Etching

Superhydrophobic surfaces wit ordered hierarchical microstructures were prepared on copper substrates by combining thermal transfer and etching. The surface morphology, wettability, chemical composition corrosion resistance were, respectively, characterized via scanning electron microscopy, a three-dimensional confocal microscope, contact angle measurement, X-ray diffraction, photoelectron spectroscopy, electrokinetic polarization electrochemical impedance spectroscopy techniques. of the obtained superhydrophobic is up to 153.3° with reduction in current density from 3.9105 × 10−5 A/cm2 3.5421 10−6 curve test, maximum capacitive arc radius about 2.5 104 Ω cm2 which two orders magnitude higher than that bare substrate, modulus value |Z| also indicating has better resistance. This method provides an effective etching approach toward preparing microstructures.